From design and prototyping to production and final test, we take pride in providing the services you need to get your custom microelectronics from concept to component. As part of our process, our engineers work as an extension of your development team to enable the optimal packaging solution for your product. Key services we provide include:

• Package Design – Ensuring Your Product's Success
• Test Services – Verifying Your Component Performance
• Manufacturing – US-based Assembly of Your Components
• Reliability & Failure Analysis – Identifying and Eliminating Potential Failures
• Project Management – From Design to Finished Component

Data Converter Modules – Performance Enabling Technologies

High-performance analog-to-digital (ADC) and digital-to-analog (DAC) converter modules from Maxtek offer exceptional sample rate and bandwidth. By providing real-time streaming, these modules are ideal for embedded systems requiring wide instantaneous bandwidth.

• Tektronix-designed ASICs for ultra high-speed data conversion technology
• IBM 180nm 7HP Silicon Germanium (SiGe)
  BiCMOS process
• Maxtek custom IC packages and modules