High frequency signals demand short path lengths, controlled line impedance, minimal discontinuities and optimal shielding. Intelligent designs prevent rise and fall time degradation, duty cycle distortion and over/undershoot problems. Using circuit simulation, EM simulators and other advanced design tools, Maxtek engineers characterize device I/Os and package structures to generate high frequency models and create packaging solutions optimized for the desired device characteristics. Using technologies such as BGA minimizes interconnects while providing fine-pitch connections.