Although flip chip assembly is not a new technology, it is gaining increasing popularity as a packaging strategy due to the benefits it can provide. By using the entire surface of the die for establishing interconnect, the need for wire bond interconnect is eliminated and package size can be reduced.

More importantly for high-performance applications, directly connecting the die to a substrate or board greatly shortens the signal path while reducing the interconnect inductance and capacitance, all of which serves to greatly improve electrical performance.